| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of detecting a defect position of a semiconductor wafer, in which a defect such as chipping smaller than a notch and cracking in a wafer outer peripheral region off a pattern can be precisely detected. SOLUTION: A first detecting means detects an outer peripheral shape of the semiconductor wafer, and the center position of the wafer is obtained based upon the detection result of the first detecting means. Further, a second detecting means receives reflected light from a wafer surface, and a positioning position is detected based upon the detection result of the second detecting means to obtain the positioning position. Further, a defect is detected based upon the detection result of the second detecting means to obtain the position of the defect. COPYRIGHT: (C)2009,JPO&INPIT
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