ALIGNMENT CORRECTION SYSTEM AND METHOD OF USE

摘要

A system and method for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool (10) comprising at least one contact (12) near a circumference of the tool and a grounded contact (14a) proximate to the at least one contact. The method comprises measuring current on each branch of a circuit and calculating an angle of a wafer based on a difference in the current on each branch of the circuit.