发明名称 CURABLE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable composition giving cured products improved in residual tack and reduced in stickiness, within the physical property range having tensile characteristics and rubber elasticity required of sealing compositions for general architectural use. SOLUTION: The present invention provides the curable composition which comprises (I) 100 parts by weight of a reactive silicon group-containing polyether oligomer with the percentage of the number of reactive silicon groups to the number of molecular chain terminals as determined by<SP>1</SP>H-NMR analysis being not less than 85% and (II) 1 to 500 parts by weight of a plasticizer. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009013430(A) 申请公布日期 2009.01.22
申请号 JP20080274663 申请日期 2008.10.24
申请人 KANEKA CORP 发明人 ODAKA HIDETOSHI;KANAMORI TOMOKA;ITO YASUSHI;KINO HIDEJI;IWAKIRI HIROSHI;KAWAKUBO FUMIO
分类号 C08L71/02;C08G65/336 主分类号 C08L71/02
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