| 发明名称 |
PLATING PROCESSING METHOD, LIGHT TRANSMITTING CONDUCTIVE FILM AND ELECTROMAGNETIC WAVE SHIELDING FILM |
| 摘要 |
A plating processing method comprises performing a continuous electrolytic plating of the surface of a film having a surface resistivity in the range of 1 Omegaf/Sq to 1000 Omega/Sq, wherein a distance between the lowest contacting part of a negative electrode with the film and a plating liquid is in the range of 0.5 cm to 15 cm.
|
| 申请公布号 |
US2009020712(A1) |
申请公布日期 |
2009.01.22 |
| 申请号 |
US20060908500 |
申请日期 |
2006.03.14 |
| 申请人 |
FUJIFILM CORPORATION |
发明人 |
MATSUMOTO JUN |
| 分类号 |
G21F3/00;C25D3/46;C25D5/48;G02B5/20 |
主分类号 |
G21F3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
