发明名称 LASER MARKING APPARATUS FOR COIL SPRING, COIL SPRING MANUFACTURING APPARATUS, AND COIL SPRING SUBJECTED TO LASER MARKING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser marking apparatus for a coil spring, which can perform a laser marking on the curved surface of an outer circumferential surface of the coil spring, a coil spring manufacturing apparatus and a coil spring subjected to the laser marking by which the traceability of each coil spring can be enhanced. <P>SOLUTION: The laser marking apparatus 100 for the coil spring holds a coil spring 300 to be fed, detects an area of 90-180°from a wind-terminating end of an end coil portion of the coil spring 300, and determines a plurality of marking parts on both side curved surfaces of an outermost circumferential line of the coil spring 300. Laser beams are applied to the marking parts from a laser beam application unit 103a to perform the laser marking of the depth of 0.05-3% of the diameter of a wire forming the coil spring 300. The coil spring manufacturing apparatus 200 forms the coil spring 300 from a wire 30 to be fed, and cuts the coil spring 300 from a non-formed wire after performing the laser marking similarly to the laser marking apparatus 100 for coil springs. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009012037(A) 申请公布日期 2009.01.22
申请号 JP20070176430 申请日期 2007.07.04
申请人 NIPPON BANE KOGAKU KENKYUSHO:KK 发明人 AKAMATSU YOSHIYUKI
分类号 B23K26/00;B21F3/04;B21F35/00;F16F1/06 主分类号 B23K26/00
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