| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component connection structure formed by bonding a housing and a substrate with an adhesive providing adhesion by being cured, wherein gas is prevented from remaining as a void in the adhesive as much as possible even when a bonding region expands. <P>SOLUTION: A through hole 50 as a discharge path for discharging gas produced in a first adhesive 41 during curing to the outside is provided in the housing 10 between the housing 10 and substrate 20 bonded together with the first adhesive 41. The through hole 50 is provided which extends from the bonding region on one surface 11 of the housing 10 where the first adhesive 41 is disposed to a non-bonding region where the first adhesive 41 is not disposed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
