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发明名称
照明用大功率发光二极管封装结构
摘要
申请公布号
CN300877649D
申请公布日期
2009.01.21
申请号
CN200830238328.2
申请日期
2008.09.11
申请人
杭州友旺科技有限公司
发明人
程 野
分类号
26-04
主分类号
26-04
代理机构
代理人
主权项
地址
310052浙江省杭州市滨江区环兴路1号厂房1楼(高新区)
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