| 摘要 |
<p>A sealed electronic module includes a housing (10) having an open end, a main circuit board (12) and at least one auxiliary circuit board (14), where the main and auxiliary circuit boards (12, 14) are both secured in the housing (10) without fasteners by a potting material (70) that is applied to the exposed face (62) of the main circuit board (12). The main circuit board (12) is peripherally supported by a housing ledge (46, 54), and the auxiliary circuit board (14) is disposed inboard of the main circuit board (12). A controlled amount of the potting material (70) applied to the exposed face (62) of the main circuit board (12) flows through one or more strategically placed apertures (64) in the main circuit board (12), forming one or more bridges of potting material (70a) between the main circuit board (12) and the underlying surface of the auxiliary circuit board (14) so that potting material (70) applied in a single step secures both circuit boards (12, 14) in the housing (10) while environmentally sealing the module.
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