发明名称
摘要 PROBLEM TO BE SOLVED: To form an accurate circuit pattern and to bond it to an electronic component with high accuracy even in a flexible film that is easy to cause dimensional change under the influence of heat, humidity and external force. SOLUTION: This member for a circuit board comprises at least a reinforcing board, a peelable organic layer, a circuit pattern of metal and a flexible film. This manufacturing method for an electronic component mounting circuit board uses the member for a circuit board. COPYRIGHT: (C)2004,JPO
申请公布号 JP4211413(B2) 申请公布日期 2009.01.21
申请号 JP20030023269 申请日期 2003.01.31
申请人 发明人
分类号 H01L21/60;H05K1/02 主分类号 H01L21/60
代理机构 代理人
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