| 摘要 |
Disclosed is an electroless Ni-P plating method which comprises a step for preparing a substrate having an insulating substrate and a copper alloy layer of a certain pattern including a plurality of island portions separated from each other, a step for preparing a plating liquid for performing an electroless Ni-P plating, a step for preparing a solid piece having at least Ni, Ni-P, Co or Co-Ni in the surface, and a step for selectively forming an electroless Ni-P plating film on the surfaces of the island portions by bringing the solid piece into contact with the surfaces of the island portions, while having at least two of the island portions in contact with the plating liquid. This method enables to selectively perform a highly precise Ni-P plating on a copper pattern on an insulating substrate, and is commercially applicable.
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