| 摘要 |
<p>A gold finger of circuit board and manufacturing method thereof are provided to maintain intensity of gold finger after cutting a board edge by removing connection bars of board edge through etching process. A circuit board(200) having a board edge(202) for cutting is provided. A copper conductive line pattern is formed on the circuit board, and includes a plurality of gold finger bodies(206) and a plurality of connection bars. Each connection bar is connected to a corresponding gold finger, and crosses the board edge. A first dry film is formed on the circuit board, and includes a plurality of openings. Each opening exposes a corresponding gold finger body. A surface of exposed gold finger bodies is plated with gold. The first dry film is removed. The connection bar is removed from the board edge through an etching process.</p> |
