| 摘要 |
A circuit assembly includes a first substrate formed with a first wiring pattern, a second substrate formed with a second wiring pattern, and a joint member for electrically and/or mechanically connecting the first substrate to the second substrate. The joint member includes a set of separated leads extending generally parallel to each other, and a first and a second retainers transversely connecting the leads to each other. The first and the second retainers are formed by molding a resin so that they are integral with the leads by allowing the molding resin to enter the spaces between the leads.
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