| 摘要 |
<p>A magnetron sputtering magnet assembly movable generally parallel to the sputtered surface of a target while facing the target, characterized in that it comprises an inner magnet which extends generally perpendicularly to the movement direction and whose N or S pole faces the target, an outer magnet which surrounds the inner magnet with a spacing from each other and whose magnetic pole opposite to that of the inner magnet faces the target, and a nonmagnetic member which is provided between the inner and outer magnets and holds the inner and outer magnets and that each of the magnetic poles facing the target is reversible. Since variation of the electron density at the end of the target is suppressed, the plasma density in the portion becomes uniform. With this, the sputtering rate at the end of the target becomes uniform and variation in deposition distribution on the object to be sputtered is suppressed. Variation of the target erosion is small and the target use efficiency is increased.</p> |
