| 摘要 |
<p>The package (10) has a group of components (30) arranged on a substrate (20) e.g. plate, and a solder pad (23) fixed to the substrate opposite to the group. A frame (60) e.g. grid, is prearranged on the substrate, and a peripheral shield (61) is arranged on the substrate around the group. An insulating material (40) seals the group, defines a tunnel (41), and is constituted of a molding compound. An upper shield (50) is pre-arranged on the insulating material, and has a column (51) inserted through the tunnel and connected to the solder pad. The shields are metal coatings. The peripheral shield and the upper shield are produced by cathode sputtering.</p> |
