| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition having high glass transition temperature, and also having excellent adhesiveness, hot adhesiveness, solder heat resistance and processability, and to provide an adhesive sheet and a cover lay film using the composition. SOLUTION: The adhesive composition comprises (A) an epoxy resin except the following component (B), (B) a phenoxy resin having≥10,000 weight average molecular weight, and containing a bisphenol S skeleton and a biphenyl skeleton in one molecule, (C) a carboxy group-containing acrylonitrile-butadiene rubber, (D) an amine-based curing agent, (E) a curing accelerator and (F) an inorganic filler. COPYRIGHT: (C)2009,JPO&INPIT
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