发明名称 SEMICONDUCTOR SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor substrate having a crystal semiconductor layer that can withstand practical use even if using a material differing from a semiconductor layer as a support substrate, and to provide a semiconductor device using the semiconductor substrate. SOLUTION: The semiconductor substrate has: a junction layer forming a junction surface between a support substrate and a single-crystal semiconductor layer; a barrier layer formed by an insulating material containing nitrogen; a relaxing layer formed by an insulating material containing 1-20 atom% hydrogen while nitrogen concentration is less than 20 atom%; and an insulation layer containing halogen. The above configuration is contained at least partially, and a gate insulation layer manufactured with SiH<SB>4</SB>and N<SB>2</SB>O as source gases by a microwave plasma vapor phase epitaxy method is in contact with the single-crystal semiconductor layer. COPYRIGHT: (C)2009,JPO&amp;INPIT
申请公布号 JP2009010351(A) 申请公布日期 2009.01.15
申请号 JP20080134150 申请日期 2008.05.22
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;ICHIJO MITSUHIRO;FURUNO MAKOTO;OTSUKI TAKASHI;OKAZAKI KENICHI;TANAKA TETSUHIRO;YASUMOTO KIYOHARU
分类号 H01L21/02;H01L21/20;H01L21/265;H01L21/322;H01L21/336;H01L27/12;H01L29/786 主分类号 H01L21/02
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