发明名称 |
SEMICONDUCTOR SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate having a crystal semiconductor layer that can withstand practical use even if using a material differing from a semiconductor layer as a support substrate, and to provide a semiconductor device using the semiconductor substrate. SOLUTION: The semiconductor substrate has: a junction layer forming a junction surface between a support substrate and a single-crystal semiconductor layer; a barrier layer formed by an insulating material containing nitrogen; a relaxing layer formed by an insulating material containing 1-20 atom% hydrogen while nitrogen concentration is less than 20 atom%; and an insulation layer containing halogen. The above configuration is contained at least partially, and a gate insulation layer manufactured with SiH<SB>4</SB>and N<SB>2</SB>O as source gases by a microwave plasma vapor phase epitaxy method is in contact with the single-crystal semiconductor layer. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009010351(A) |
申请公布日期 |
2009.01.15 |
申请号 |
JP20080134150 |
申请日期 |
2008.05.22 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
YAMAZAKI SHUNPEI;ICHIJO MITSUHIRO;FURUNO MAKOTO;OTSUKI TAKASHI;OKAZAKI KENICHI;TANAKA TETSUHIRO;YASUMOTO KIYOHARU |
分类号 |
H01L21/02;H01L21/20;H01L21/265;H01L21/322;H01L21/336;H01L27/12;H01L29/786 |
主分类号 |
H01L21/02 |
代理机构 |
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地址 |
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