发明名称 NANOSILICON SEMICONDUCTOR SUBSTRATE PRODUCTION PROCESS, SEMICONDUCTOR CIRCUIT DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate structure capable of controlling the threshold voltage of a MOS transistor, without depending on the substrate concentration and readily suppressing short-channel effect caused by reducing the channel length. <P>SOLUTION: A first nanosilicon film 201 formed from nanosilicon grains having the same grain size is formed on a silicon oxide film 200A on the surface of a silicon substrate 200. After a silicon nitride film 201A is formed on the first nanosilicon film 201, a second nanosilicon film 202, having an average grain size different from that of the first nanosilicon film 201, is formed. A semiconductor circuit device is formed on a nanosilicon semiconductor substrate, manufactured in this way. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009010342(A) 申请公布日期 2009.01.15
申请号 JP20080121634 申请日期 2008.05.07
申请人 CANON ANELVA CORP 发明人 MURAO YUKINOBU;KUMAGAI AKIRA;NUMAZAWA YOICHIRO
分类号 H01L21/336;B82B3/00;H01L21/316;H01L21/8234;H01L27/08;H01L27/088;H01L29/06;H01L29/12;H01L29/78;H01L29/786 主分类号 H01L21/336
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