| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package with superior signal quality that can sufficiently secure the area of a ground conductor layer and prevent a signal current from leaking from a signal terminal electrode and signal wiring to the ground conductor layer. SOLUTION: The semiconductor package according to the present invention has a semiconductor chip and a package substrate 2, wherein the package substrate 2 has a semiconductor chip mount surface 6 and a terminal electrode formation surface 9 where signal terminal electrodes 7 and ground terminal electrodes 8 are disposed in array. On the semiconductor chip mount surface 6, first signal wiring 11, ground wiring 12, and the ground conductor layer 13 are provided, and on the terminal electrode formation surface 9, second signal wiring 14 and ground fine wiring 15 are provided, the first signal wiring 11 and second signal wiring 14, and ground wiring 12 and ground fine wiring 15 being connected through conductors 16a and 17a formed penetrating the package substrate 2. COPYRIGHT: (C)2009,JPO&INPIT
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