发明名称 LED-SIGNALMODUL
摘要 The module has a number of LED components (2) on a first main surface (11) of an electrically insulating circuit board (10) and a cooling device (3) on an opposing second main surface (12), conducting tracks (4) on the first main surface and dust-tight thermally conducting leadthroughs (50) providing a thermally conducting connection from the conducting tracks to the second main surface.
申请公布号 AT419492(T) 申请公布日期 2009.01.15
申请号 AT20020090004T 申请日期 2002.01.08
申请人 SIEMENS AKTIENGESELLSCHAFT;OSRAM OPTO SEMICONDUCTORS GMBH 发明人 BLUEMEL, SIMON;HEILMANN, AXEL;KREPLIN, ULRICH;ZABEL, MICHAEL;ZIMMERMANN, DIRK
分类号 F21S8/00;F21V5/04;F21V17/16;F21V29/00;F21Y101/02;H01L25/13;H01L33/00;H05K1/02 主分类号 F21S8/00
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