发明名称 |
PHOTOSENSITIVE ADHESIVE RESIN COMPOSITION, ADHESIVE FILM AND LIGHT-RECEIVING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive adhesive resin composition having excellent developability and being used for producing a spacer which is arranged between a transparent substrate and a substrate on which a semiconductor element is mounted, and an adhesive film and a light-receiving device using the same. <P>SOLUTION: The photosensitive adhesive resin composition contains a compound (A) having a hydroxyl group or carboxyl group and a (meth)acryloyl group; a compound (B) thermosettingly reactive with the compound (A) having a hydroxyl group or carboxyl group and a (meth)acryloyl group; a compound (C) having a (meth)acryloyl group but not having a hydroxyl group and a carboxyl group; a phenol resin or phenol (D); and a sensitizer (E). <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009009110(A) |
申请公布日期 |
2009.01.15 |
申请号 |
JP20080130328 |
申请日期 |
2008.05.19 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
TAKAYAMA RIE;TAKAHASHI TOYOSEI |
分类号 |
G03F7/027;C09J4/02;C09J7/02;C09J11/04;C09J11/06;C09J161/06;C09J163/00;C09J201/00;G03F7/004;G03F7/038 |
主分类号 |
G03F7/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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