发明名称 Plasma enhanced bonding for improving adhesion and corrosion resistance of deposited films
摘要 Plasma Enhanced Bonding (PEB) during a coating process is used to improve both adhesion and corrosion resistance of the resulting coating. New interfacial compounds may be formed, offering the increased resistance to corrosion, as well as enhanced bonding to the workpiece being coated and any subsequently formed layer, such as diamond-like carbon. In one embodiment, the PEB processing is employed during coating of at least one interior surface of the workpiece, which may be a pipe. In a first step, a thin film is deposited. Then, the film is exposed to a high energy etch-back plasma. This two-step cycle of depositing a film and then providing bombardment of the film may be repeated a number of times. Typically, the deposition step of the cycle is much shorter than the bombardment step.
申请公布号 US2009017222(A1) 申请公布日期 2009.01.15
申请号 US20070006188 申请日期 2007.12.31
申请人 DORNFEST CHARLES N;UPADHYAYA DEEPAK;BOARDMAN WILLIAM JOHN;BOINAPALLY KARTHIK 发明人 DORNFEST CHARLES N.;UPADHYAYA DEEPAK;BOARDMAN WILLIAM JOHN;BOINAPALLY KARTHIK
分类号 H05H1/24;H05H1/00 主分类号 H05H1/24
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