发明名称 |
HALOGEN-FREE PHOSPHOROUS EPOXY RESIN COMPOSITION |
摘要 |
The present invention relates to a halogen-free phosphorous epoxy resin composition, primarily used as an adhesive for the printed circuit board. The composition comprises a halogen-free phosphorous contained epoxy resin which reduces the addition amount of additional flame retardant; in order to offer flame retardancy while maintaining high flexibility of flexible printed circuit board.
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申请公布号 |
US2009018241(A1) |
申请公布日期 |
2009.01.15 |
申请号 |
US20070162610 |
申请日期 |
2007.02.22 |
申请人 |
CHENG YU HSAIN;TE WE MING |
发明人 |
CHENG YU HSAIN;TE WE MING |
分类号 |
C08K5/3492;C08G8/04;C08K3/32;C08K3/36;C08K3/38 |
主分类号 |
C08K5/3492 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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