| 摘要 |
A flip-chip package structure is disclosed, which comprises: a packaging substrate having an upper surface and a plurality of conductive pads formed on the upper surface; a semiconductor chip having an active surface and a plurality of electrode pads formed on the active surface; and a plurality of first solder bumps; wherein each first solder bump connects to an electrode pad and a conductive pad, and each first solder bump contains a solid grain.
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