发明名称 Method of producing large area SiC substrates
摘要 A method for growing a SiC-containing film on a Si substrate is disclosed. The SiC-containing film can be formed on a Si substrate by, for example, plasma sputtering, chemical vapor deposition, or atomic layer deposition. The thus-grown SiC-containing film provides an alternative to expensive SiC wafers for growing semiconductor crystals.
申请公布号 US2009014756(A1) 申请公布日期 2009.01.15
申请号 US20070826278 申请日期 2007.07.13
申请人 SINGH NARSINGH BAHADUR;WAGNER BRIAN P;KNUTESON DAVID J;KAHLER DAVID;BERGHMANS ANDRE E;AUMER MICHAEL;HEDRICK JERRY W;SHERWIN MARC E;FITELSON MICHAEL M;USEFARA MARK S;MCLAUGHLIN SEAN;RANDALL TRAVIS;KNIGHT THOMAS J 发明人 SINGH NARSINGH BAHADUR;WAGNER BRIAN P.;KNUTESON DAVID J.;KAHLER DAVID;BERGHMANS ANDRE E.;AUMER MICHAEL;HEDRICK JERRY W.;SHERWIN MARC E.;FITELSON MICHAEL M.;USEFARA MARK S.;MCLAUGHLIN SEAN;RANDALL TRAVIS;KNIGHT THOMAS J.
分类号 H01L29/739;B32B5/16;H01L21/20 主分类号 H01L29/739
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