发明名称 ELECTRONIC DEVICE PACKAGE AND METHOD FOR FORMING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electronic device package which can be applied in an electronic industy for a hermetic package containing one or more electronic devices such as an optoelectronic device, an IC, an MEMS device, and a method for forming the same. SOLUTION: The electronic device package includes an electronic device 28 mounted to a substrate 4, a conductive via 18 and a locally thinned region on the substrate. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009010323(A) 申请公布日期 2009.01.15
申请号 JP20080042222 申请日期 2008.02.22
申请人 ROHM & HAAS ELECTRONIC MATERIALS LLC 发明人 GETZ JAMES W;SHERRER DAVID W;FISHER JOHN J
分类号 H01L23/04;B81B1/00;B81C1/00 主分类号 H01L23/04
代理机构 代理人
主权项
地址