摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device package which can be applied in an electronic industy for a hermetic package containing one or more electronic devices such as an optoelectronic device, an IC, an MEMS device, and a method for forming the same. SOLUTION: The electronic device package includes an electronic device 28 mounted to a substrate 4, a conductive via 18 and a locally thinned region on the substrate. COPYRIGHT: (C)2009,JPO&INPIT |