| 发明名称 |
PRINTED CIRCUIT BOARD ASSEMBLED PANEL, UNIT SHEET FOR PACKAGING A PRINTED CIRCUIT BOARD, RIGID-FLEXIBLE BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A method for manufacturing a printed circuit board assembled panel by a simple process with an excellent material yield and a high conforming product rate. Unit printed circuit boards previously manufactured are arranged in a frame in a prescribed relationship. Then, the printed circuit boards are fixed to one another, and the printed circuit board and the frame body are fixed to one another.
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| 申请公布号 |
US2009014205(A1) |
申请公布日期 |
2009.01.15 |
| 申请号 |
US20050547715 |
申请日期 |
2005.04.04 |
| 申请人 |
KOBAYASHI ATSUSHI;UMEDA KAZUO;GOTOU WATARU;SAHARA TAKAHIRO;NAKAZAWA SUSUMU;TAKEUCHI KIYOSHI;TERAUCHI TAKAYUKI |
发明人 |
KOBAYASHI ATSUSHI;UMEDA KAZUO;GOTOU WATARU;SAHARA TAKAHIRO;NAKAZAWA SUSUMU;TAKEUCHI KIYOSHI;TERAUCHI TAKAYUKI |
| 分类号 |
H05K1/02;H05K1/03;H05K3/00;H05K3/36;H05K3/46 |
主分类号 |
H05K1/02 |
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