| 摘要 |
<p>Intended is to discriminate the direction or the like of an image sensor even after a plurality of imaging devices formed integrally were cut and separated into the individual imaging devices, and to discriminate what position the imaging devices were integrally formed at. Provided is an imaging device manufacturing method, which comprises the step of forming a plurality of imaging elements on one face of a silicon wafer, the step of sealing a light receiving pixel portion for each imaging element by an imaging optical system, the step of cutting the silicon wafer into the individual imaging elements, the step of placing the cut imaging elements on a substrate, the step of connecting the substrate and the imaging elements electrically, the step of molding the substrate, the imaging optical system and the imaging elements integrally by a mold having identification marks for every imaging elements, and the step of cutting and separating the molded substrate for every imaging elements.</p> |
