发明名称 Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
摘要 An electromagnetic shielding copper foil superior in electromagnetic shielding ability, high in transmittance, and free from particle shedding comprising a copper foil on at least one surface of which a fine roughening particle layer of copper or an alloy is provided and having on the fine roughening particle layer a smoothening layer comprised of cobalt, nickel, indium, or an alloy of the same and an electromagnetic shield able to be suitably used for a PDP using the same. The fine roughening particle layer may also be a layer comprised of a fine particle roughening particle layer of copper on which a fine roughening particle layer of a copper alloy is stacked or may also be formed by a copper-cobalt-nickel alloy. The smoothening layer of the copper foil may be treated for stainproof or by a silane coupling agent to protect the surface of the copper foil.
申请公布号 US7476449(B2) 申请公布日期 2009.01.13
申请号 US20040785973 申请日期 2004.02.26
申请人 FURUKAWA CIRCUIT FOIL CO., LTD. 发明人 YOSHIHARA YASUHISA;KIMIJIMA HISAO
分类号 B32B15/16;H05K9/00;C25D3/56;C25D3/58;C25D5/10;C25D5/16;H05K1/02;H05K3/38 主分类号 B32B15/16
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