发明名称 |
Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
摘要 |
An electromagnetic shielding copper foil superior in electromagnetic shielding ability, high in transmittance, and free from particle shedding comprising a copper foil on at least one surface of which a fine roughening particle layer of copper or an alloy is provided and having on the fine roughening particle layer a smoothening layer comprised of cobalt, nickel, indium, or an alloy of the same and an electromagnetic shield able to be suitably used for a PDP using the same. The fine roughening particle layer may also be a layer comprised of a fine particle roughening particle layer of copper on which a fine roughening particle layer of a copper alloy is stacked or may also be formed by a copper-cobalt-nickel alloy. The smoothening layer of the copper foil may be treated for stainproof or by a silane coupling agent to protect the surface of the copper foil.
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申请公布号 |
US7476449(B2) |
申请公布日期 |
2009.01.13 |
申请号 |
US20040785973 |
申请日期 |
2004.02.26 |
申请人 |
FURUKAWA CIRCUIT FOIL CO., LTD. |
发明人 |
YOSHIHARA YASUHISA;KIMIJIMA HISAO |
分类号 |
B32B15/16;H05K9/00;C25D3/56;C25D3/58;C25D5/10;C25D5/16;H05K1/02;H05K3/38 |
主分类号 |
B32B15/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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