BONDING INSPECTION APPARATUS OF HEAT SINK AND HYBRID INTEGRATED CIRCUIT BOARD

摘要

An apparatus for inspecting bonding of a heat sink and a hybrid integrated circuit board is provided to reduce a failure generating rate by sensing the coming off of an HIC board and the warp of a lead frame automatically. A transfer conveyor(10) transfers a heat sink in which a hybrid integrated circuit board and a lead frame are successively assembled. A support frame(30) composed of a vertical frame(31) and a horizontal frame(32) is formed in one side of the transfer conveyor. The vertical frame is perpendicular to the surface. The horizontal frame is perpendicular to the vertical frame. A first cylinder block moves a first piston rod vertically by a hydraulic pressure. A moving lower plate(70) is fixed to the first piston rod. A second cylinder block(120) is equipped in the moving lower plate. A second cylinder block is elastically supported by a predetermined elastic member(122). The second piston rod contacting the hybrid integrated circuit assembled in the heat sink or the lead frame is equipped in the bottom of the second cylinder block. A sensor(150) is separated from an upper surface of the moving lower plate. A sensor target(140) is equipped in an upper part of the second piston rod and interferes the sensor.