| 摘要 |
a resin composition which can exert high heat resistance and a low dielectric constant; a varnish or a resin film comprising the resin composition; and a semiconductor device using the resin film. Disclosed is a resin composition comprising a compound having a structure represented by the general formula (1) and a cross-linking agent. In the formula (1), R0 represents a single bond or a structure represented by the general formula (2); R1 to R8 independently represent a hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms which is different from the group having an alicyclic structure, a hydroxyl group or a carboxyl group; and X represents-O-,-NHCO-,-CONH-,-COO-or-COC-; and in the formula (2), Ar represents an aromatic group; Y represents a single bond,-O-,-S-,-OCO-or-COO-; q is an integer of 1 or greater; and R9 represents a hydrogen or an organic group having 1 or more carbon atoms; provided that, multiple R9's may be the same as or different from each other when q is an integer of 2 or greater; provided that, at least one of R1 to R8 represents a group having the alicyclic structure when R0 represents a single bond, and at least one of R1 to R9 represents a group having the alicyclic structure when R0 represents a structure represented by the general formula (2); and ''*'' and ''**'' independently represent a site to which other chemical structure is bound. |
