发明名称 Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
摘要 The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.
申请公布号 US7473458(B2) 申请公布日期 2009.01.06
申请号 US20050506529 申请日期 2005.01.31
申请人 HITACHI CHEMICAL CO., LTD. 发明人 TAKAI KENJI;SUEYOSHI TAKAYUKI
分类号 B32B3/00;B32B15/08;C23C28/00;H05K3/38;H05K3/46 主分类号 B32B3/00
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