发明名称 MAGNETRON SPUTTERING APPARATUS AND MANUFACTURING METHOD FOR STRUCTURE OF THIN FILM
摘要 According to an aspect of an embodiment, a magnetron sputtering apparatus sputtering a target by a plasma includes a plurality of magnets that are arranged in the vicinity of a position where the target is disposed. The plurality of magnets form a magnetic field for confining the plasma; and a rotating mechanism rotates the plurality of magnets around a rotation center.
申请公布号 US2009000943(A1) 申请公布日期 2009.01.01
申请号 US20080144301 申请日期 2008.06.23
申请人 FUJITSU LIMITED 发明人 FURUYA ATSUSHI;FUJISAKI AKIHIKO;KUBOTA TETSUYUKI;KUTSUZAWA TOMOKO
分类号 C23C14/35 主分类号 C23C14/35
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