| 摘要 |
A high-capacity memory subsystem architecture utilizes multiple memory modules coupled to one or more access modules by a communications medium, in which at least some data is transferred between an access module and memory modules at a first bus frequency, and at least some data is transferred between the access module and memory modules at a second bus frequency different from the first. Preferably, data is interleaved to reduce the required bus speed for read/write data, and the higher bus frequency is used to transfer command/address data. Preferably, the memory system employs memory chips having dual-mode operation, one of which supports a dual-speed bus.
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