| 发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SIDE SUBSTRATE |
| 摘要 |
An integrated circuit package system comprising: providing a package substrate; attaching an integrated circuit over the package substrate; and attaching a side substrate adjacent the integrated circuit over the package substrate.
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| 申请公布号 |
US2009001545(A1) |
申请公布日期 |
2009.01.01 |
| 申请号 |
US20070772044 |
申请日期 |
2007.06.29 |
| 申请人 |
KIM KYUNGOE;KANG TAEWOO;SHIN HYUNSU |
发明人 |
KIM KYUNGOE;KANG TAEWOO;SHIN HYUNSU |
| 分类号 |
H01L23/48;H01L21/58 |
主分类号 |
H01L23/48 |
| 代理机构 |
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