GOOD CHIP CLASSIFYING METHOD ON WAFER, AND CHIP QUALITY JUDGING METHOD, MARKING MECHANISM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE GOOD CHIP CLASSIFYING METHOD

摘要

In a disclosed good chip classifying method capable of classifying the good chips on a wafer, defective chips are divided into defective groups so that the defective chips contiguous to each other are placed into the same defective group based on the wafer test results; the defective group is judged as a defective chip concentrated distribution area when the number of the defective chips exceeds the prescribed value; a defective chip concentrated distribution nearby area including all the defective chips in the defective chip concentrated distribution area and nearby good chips is formed; and the good chips in the defective chip concentrated distribution nearby area are classified to have a chip index based on four directions (X and Y axis directions) on which the defective chips in the defective chip concentrated distribution area are disposed.