| 摘要 |
<p>The invention relates to the manufacture of batches of boards each including an electronic module (2) and in which a filler or a resin is to be added for covering at least the electronic modules and for filling the empty gaps remaining in the openings (16) of a perforated board (14), wherein the method comprises manufacturing during a first step an assembly (13) formed by the perforated board (14) in which is provided a plurality of electronic modules (2). The openings (16) have dimensions slightly larger than that of the electronic modules. In order to form a material link between the electronic modules and the board, a sheet (18) is provided on one side of the board (14) and the board and the electronic modules are maintained on said sheet using an adhesive material. It is thus possible to obtain a solid assembly that can be handled and introduced into a resin deposition equipment. Moreover, the electronic modules remain in position relative to the board upon the addition of resin.</p> |
