| 发明名称 |
ADHESIVE RESIN COMPOSITION, ADHESIVE FILM, DICING DIE BONDING FILM AND SEMICONDUCTOR DEVICE USING THE SAME |
| 摘要 |
An adhesive resin composition is provided to ensure excellent reliability of semiconductor package by maintaining high adhesive force and no void generation, and excellent step coverage of a wiring board. An adhesive resin composition comprises (a) a flexible epoxy resin having a glass transition temperature after curing of 50‹C or less; (b) a rigid epoxy resin having a glass transition temperature after curing of excess 50‹C; (c) a hardener; and (d) at least two kinds of a curing accelerator. |
| 申请公布号 |
KR20080113670(A) |
申请公布日期 |
2008.12.31 |
| 申请号 |
KR20070062436 |
申请日期 |
2007.06.25 |
| 申请人 |
LG CHEM. LTD. |
发明人 |
YOO, HYUN JEE;PARK, HYO SOON;KIM, JANG SOON;HONG, JONG WAN;KHO, DONG HAN |
| 分类号 |
C09J163/00 |
主分类号 |
C09J163/00 |
| 代理机构 |
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代理人 |
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