| 摘要 |
A printed circuit board assembly includes a printed circuit board 22 having a first coefficient of thermal expansion, an integrated circuit die 24 having a base formed from a material having a second coefficient of thermal expansion, and an interposer 30 having a coefficient of thermal expansion intermediate the first and second coefficients of thermal expansion for electrically connecting the board 22 and the die 24. The interposer may be formed from a sheet of material with through holes 32 for electrically connecting the die to the board when a conductive material 26, 28 fills the holes. Alternatively, the interposer may have legs for connecting the die to the board (figure 5). The interposer may be formed from a powdered metal injection molding compound or a polyimide of bismuth telluride. The interposer may be used to connect a silicon based switch such as a field effect transistor to a glass epoxy based PCB. |
