REACTIVE MULTILAYER JOINING TO CONTROL THERMAL STRESS
摘要
<p>A method for bonding components with a reactive multilayer foil, wherein during bonding, the components are held at a temperature or temperature gradient chosen to reduce thermal stress in the resulting bonded product.</p>
申请公布号
WO2009002852(A2)
申请公布日期
2008.12.31
申请号
WO2008US67695
申请日期
2008.06.20
申请人
REACTIVE NANOTECHNOLOGIES, INC.;WEIHS, TIMOTHY, P.;DUCKHAM, ALAN;NEWSON, JESSE, E.;LUNKING, DAVID
发明人
WEIHS, TIMOTHY, P.;DUCKHAM, ALAN;NEWSON, JESSE, E.;LUNKING, DAVID
