INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION

摘要

An IC package system including dual connection part is provided to reduce cost and to improve performance by simplifying process. A packaging method of an IC(Integrated Circuit) comprises the following steps: a step for connecting an integrated circuit die(212) with a lower connection structure(210); a step for arranging an adhesive molding compound(222) on the lower connection structure and the integrated circuit die with a state that the lower connection structure is exposed outside; and a step for arranging an upper connection structure(102) in a location facing the lower connection structure of an upside of the adhesive molding compound.