| 摘要 |
Provided is a substrate processing apparatus, which has a polishing apparatus (30A) for polishing the surface of a substrate, and at least an ultrasonic cleaning apparatus (42), which cleans the surface of the substrate by ultrasonic waves propagated through a liquid, or a double-fluid jet cleaning apparatus (44), which cleans the surface of the substrate by double fluid jet by which air and a liquid are mixed and jetted. A substrate processing method is provided with a polishing step of polishing the surface of the substrate, and a solid object noncontact cleaning step of cleaning the surface of the substrate while jetting the fluid onto the surface of the substrate. The substrate with polished surface can be efficiently cleaned by such apparatus and the method. ® KIPO & WIPO 2009 |
