| 摘要 |
<p>A substrate processing apparatus having a cleaning unit is provided to reduce the fault of a photoresist pattern formed on a semiconductor substrate by performing washing and drying a semiconductor substrate in which a dipping exposure process is performed. A substrate processing apparatus(10) comprises a first processing block(100), a second processing block(200), a main feed block(300), a third and fourth processing blocks(400,500) and a fifth processing block(800). The first processing block performs a coating process and photolithography process. The second processing block is arranged in order to face the first processing block. The second processing block heat-treats substrates. The main feed block is arranged between the first processing block and the second processing block. The main feed block transfers the substrates. The third and fourth processing block are respectively arranged in both sides of the main feed block toward a vertical direction corresponding to the arranging direction of the first and the second processing block. The third and fourth processing block control the temperature of the substrates. The fifth processing block is arranged between the fourth processing block and a dipping exposure apparatus. The fifth processing block comprises a cleaning unit(810) for washing the substrates in which a dipping exposure process is performed.</p> |
