| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure capable of both expanding a region capable of arranging a wiring of a wiring board, and maintaining a mechanical stability of a semiconductor chip. <P>SOLUTION: A semiconductor device 1 comprises a wiring board 10, a spacer 20, and the semiconductor chip 30. The spacer 20 is provided on the wiring board 10. The semiconductor chip 30 is provided on the spacer 20. Assuming an angle between the side of the spacer 20 and the side of the semiconductor chip 30 isθin planar view, the inequality expression 0<θ<90°consists. Further, a center of the spacer 20 unnecessarily corresponds to a center of the semiconductor chip 30. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
