| 摘要 |
PROBLEM TO BE SOLVED: To achieve film deposition with a narrow film thickness distribution using a target 3 with a diameter d of a substrate 2 or a diameter D smaller than that in film deposition by sputtering. SOLUTION: The sputtering system includes a substrate 2 that is rotatably set, and a target 3. If the angle of the central axis A of the target 3 to the normal of the substrate 2 is defined asθ, the distance from the intersection P between the central axis A of the target 3 and the plane including the surface of the substrate 2 to the rotary axis B of the substrate 2 is defined as F, and the distance from the intersection P to the center of the target 3 is defined as L, the target 3 is provided at a position satisfying the following conditions: d≥D, 15°≤θ45°, 50 mm≤F≤400 mm, and 50 mm≤L≤800 mm, wherein the projection plane of the target 3 to the plane including the surface of the substrate 2 comes to the outside of the substrate. COPYRIGHT: (C)2009,JPO&INPIT
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