发明名称 SUBSTRATE PRODUCTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate production method that can easily perform the processing, including a film deposition process, an etching process, a resist peeling process for a substrate to be processed under the presence of supercritical fluid. SOLUTION: The substrate production method is the substrate production method that processes the surface of the substrate with a step of filling a reaction chamber, where the substrate is installed with supercritical fluid and a step to make materials dissolved in this supercritical fluid react close to the surface of the substrate. The substrate is installed at the cealing 10 inside the reaction chamber, with the surface of the substrate facing downward. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008306175(A) 申请公布日期 2008.12.18
申请号 JP20080121338 申请日期 2008.05.07
申请人 ELPIDA MEMORY INC 发明人 OIDE HIROYUKI
分类号 H01L21/304;C23C16/44;H01L21/027;H01L21/306;H01L21/316 主分类号 H01L21/304
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