| 摘要 |
PROBLEM TO BE SOLVED: To provide a post-CMP treating liquid capable of efficiently removing sticking substances on a wiring layer and an insulating film surface. SOLUTION: The post-CMP treating liquid includes water, polyphenol, an anionic surfactant, ethylene diamine tetraacetic acid, resin particles having carboxylic group and sulfonyl group on their surfaces, a primary particle diameter thereof ranging from 10 to 60 nm, and tetramethyl ammonium hydroxide. The treating liquid has a pH ranging from 4 to 9, and exhibits a polishing rate both of an insulating film and a conductive film at a rate of 10 nm/min or less. COPYRIGHT: (C)2009,JPO&INPIT
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