| 发明名称 |
Plastic overmolded packages with mechancially decoupled lid attach attachment |
| 摘要 |
The specification describes a lidded MCM IC plastic overmolded package with a chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.
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| 申请公布号 |
US2008311700(A1) |
申请公布日期 |
2008.12.18 |
| 申请号 |
US20080228720 |
申请日期 |
2008.08.15 |
| 申请人 |
|
发明人 |
CRISPELL ROBERT B.;KISTLER ROBERT SCOTT;OSENBACH JOHN W. |
| 分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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