发明名称 SELECTIVE ELECTROLESS DEPOSITION FOR SOLAR CELLS
摘要 A metal contact structure of a solar cell substrate includes a contact with a conductive layer or a capping layer that is formed using an electroless plating process. The contact may be disposed within a hole formed through the solar cell substrate or on a non-light-receiving surface of the solar cell substrate. The electroless plating process for the conductive layer uses a seed layer that includes an activation layer for electroless plating.
申请公布号 WO2008118222(A3) 申请公布日期 2008.12.18
申请号 WO2007US85873 申请日期 2007.11.29
申请人 APPLIED MATERIALS, INC.;LOPATIN, SERGEY;SHANMUGASUNDRAM, ARULKUMAR;BACHRACH, ROBERT, Z.;GAY, CHARLES;EAGLESHAM, DAVID 发明人 LOPATIN, SERGEY;SHANMUGASUNDRAM, ARULKUMAR;BACHRACH, ROBERT, Z.;GAY, CHARLES;EAGLESHAM, DAVID
分类号 H01L31/00 主分类号 H01L31/00
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