A metal contact structure of a solar cell substrate includes a contact with a conductive layer or a capping layer that is formed using an electroless plating process. The contact may be disposed within a hole formed through the solar cell substrate or on a non-light-receiving surface of the solar cell substrate. The electroless plating process for the conductive layer uses a seed layer that includes an activation layer for electroless plating.
申请公布号
WO2008118222(A3)
申请公布日期
2008.12.18
申请号
WO2007US85873
申请日期
2007.11.29
申请人
APPLIED MATERIALS, INC.;LOPATIN, SERGEY;SHANMUGASUNDRAM, ARULKUMAR;BACHRACH, ROBERT, Z.;GAY, CHARLES;EAGLESHAM, DAVID
发明人
LOPATIN, SERGEY;SHANMUGASUNDRAM, ARULKUMAR;BACHRACH, ROBERT, Z.;GAY, CHARLES;EAGLESHAM, DAVID