| 摘要 |
A temperature detecting device includes a casing 1 and a heat detecting section 10 mounted on the casing 1. The heat detecting section 10 includes a semiconductor device 5, e.g. transistor, a stem supporting the semiconductor device 5 and provided with electrical leads connected to corresponding terminals of the semiconductor device 5 and a metal tube 2 which is fixedly secured at one end to the casing 1. The stem and the semiconductor device 5 are disposed in the metal tube 2 such that an upper surface of the semiconductor device 5 is in thermal contact with a surface of the other end of the metal tube 2 or with a heat collector 4 thermally coupled to the heat detecting section 10. In addition, the stem and the semiconductor device 5 are fixedly secured to the metal tube 2 with an adhesive material 11' having a high thermal conductivity. <IMAGE> |
