| 摘要 |
1,033,785. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. May 1, 1964, No. 18179/64. Addition to 1,010,111. Heading H1K. An assembly comprising at least two semi-conductor devices includes one or more semi - conductor wafers each containing at least one device mounted on a header via an intermediate plate or plates of glass. Electrodes on the wafers are electrically connected to deposited metal areas on the glass plate which are graded from 100% chromium adjacent the glass to 100% gold at the surface remote therefrom. The header carries a cap hermetically sealing the assembly. In a typical case (Fig. 1) a silicon planar transistor wafer is mounted on the central of three graded goldchromium strips 12, 13, 14 on a glass substrate and the wafer and gold wires joining the base and emitter to the outer strips are coated in resin. Two matched transistors of this type are stuck by resin to a header and the strips and header wires interconnected by wires welded, cold-welded or thermocompression bonded thereto. As an alternative two transistor wafers, two diode wafers, or a single wafer containing two or more devices are mounted on a common glass substrate which may carry interconnecting tracks. |
